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MIRTEC Europe Ltd.
Unit 10, 71 Sisna Park Road,
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Articles

MS-11 SPI 3D Solder Paste Inspection

15-02-11

MS-11 SPI 3D Solder Paste Inspection

Following the success of its Industry leading automated optical inspection (AOI) product line, Mirtec launched the MS-11 3D Solder paste inspection system in 2010. There was a lot of interest and it wasn’t long before the MS-11’s began arriving in customer facilities. The systems were a great success but that wasn’t the end of it, as the Mirtec SPI team worked closely with the customers to develop a wish list of reports and features which would enhance the platform beyond anything which they had previously known. Some of the customers had vast experience of SPI with multiple installations of various suppliers systems already in situ. However the Mirtec reputation and the customer’s knowledge of the company’s successful domination of the AOI sector warranted closer examination.

The MS-11 also brings another unique attribute to the customer as it utilizes the company’s standard inline platform allowing transition from SPI to AOI to LED inspection as and when required. This flexibility within the design is unique to Mirtec, and is particularly useful to the contract manufacturers who are never sure of what inspection requirement their next customer will need, as the Mirtec platform can be transformed in a few hours into whichever system is required.

The Moiré technology deployed on the MS-11 is already recognised as the best technology for the 3D SPI application, but it is the deployment in 2011 of the 15Mpx ISIS camera which will set the MS-11 apart from all others as the speed which the Mirtec can inspect will be far superior to any other system available.