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AWARD Details  
2008 Global Technology Award
2008 Global Technology Award

Award Date: 08/19/2008

MIRTEC Wins 2008 Global Technology Award

OXFORD, CT — MIRTEC Corp., the AOI market leader in North America, announces that it has earned a Global Technology Award in the Test Equipment category for its innovative MV-7L In-Line AOI System. The award was presented by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief Trevor Galbraith during a Tuesday, August 19, 2008 ceremony that took place during the SMTA International exhibition and conference in Orlando, FL.

Fully configured, the MV-7L provides one top-down camera with a native resolution of four mega pixels (2,048 x 2,048) and four side-view cameras with a native resolution of two mega pixels (1,600 x 1,200). The patented "Quad Angle Lighting System" on the system provides four independently programmable zones for optimal illumination of inspection areas.

A three-stage conveyor system with automatic board support and PCB clamping mechanism is designed for maximum throughput of the line. Precision motion control systems provide absolute reproducibility and repeatability. Additionally, a powerful OCR engine provides advanced part marking inspection. The MV-7L features ultra-high-speed PCB inspection — up to 4,940 mm2/sec (7.657 in2/s

The revolutionary Intelli-Scan Laser System provides "The Third Dimension in Inspection Capability" — the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides: superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.

The optional Side Viewer® Camera System provides four additional Two Mega Pixel Side View Digital Color Cameras for enhanced detection of lifted leads and lifted components. This system also provides solder joint inspection of J-leaded and LCC devices.

The Global Technology Awards program is sponsored by Global SMT & Packaging Magazine, and is an annual celebration of product excellence in semiconductor packaging and electronics assembly. Premier products based on the finest examples of creative advancement in technology in key areas are chosen by a distinguished panel of global industry experts.

Brian D'Amico

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